CYW20819A1KFBGT

CYW20819A1KFBGT is an AIROC™ CYW20819 Bluetooth® & Bluetooth® LE SoC. This is a Bluetooth® 5.2 core spec compliant device targeted at Bluetooth Mesh, audio, voice, wearables, mice, keyboards, gaming consoles, remote controls, home automation and a wide range of other Internet of Things (IoT) applications. The CYW20819 fully implements the Bluetooth Mesh 1.0 specification and employs the highest level of integration to eliminate external components, allowing device makers to reduce product footprints and optimize costs. The CYW20819 integrates Ultra-Low Power (ULP) BLE along with the capability to add audio functionality to enhance the user experience for wearables and trackers. Provides best-in-class receiver sensitivity for both BLE and EDR. Using advanced design techniques and process technology to reduce active and idle power, the CYW20819 also addresses the needs of a diverse class of low power Bluetooth 5-enabled devices that require minimal power consumption and compact size.

• Integrated Arm® Cortex®-M4 up to 96MHz
• 256KB flash, 176KB SRAM and 1MB ROM
• On-chip buck regulator reduces power consumption for both classic and low-energy Bluetooth
• Complete remote control and HID peripheral I/O: UARTx2
• UARTx2, ADC/PWMs/Key-scan, I2Cx2, SPIx2, quadrature decoder, analogue microphone interface, 40 GPIOs
• AES128 (hardware accelerated) and RSA2048 bit encryption
• Capability to lock down on-chip ash for security
• Bluetooth LE Tx power up to +4dBM
• Operating temperature support up to 85°C and extended temperature support on multiple packages
• 4.5mm x 4.5mm 62-ball FBGA package