CYW20737S

CYW20737S is a compact, highly integrated Bluetooth Low Energy (BLE) system-in-package (SiP) module. The CYW20737S SiP includes an embedded BLE antenna, 24 MHz clock, and 512 Kb EEPROM, so only a minimal set of external components is needed to create a standalone BLE device. The CYW20737S is designed to accelerate time to market. The Bluetooth stack and several application profiles are built into the module, allowing customers to focus on their core applications. To further reduce application development time, the CYW20737S includes integrated software support, with one-click installation of the complete environment and a one-click compile/build/link/load cycle. All this, coupled with an ultra small form factor and support for a wide voltage range, makes the CYW20737S well suited for virtually any Bluetooth Smart application.

• ARM Cortex-M3 microcontroller unit (MCU)
• Broadcom Serial Control (BSC), SPI and UART interfaces
• 6.5 mm × 6.5 mm × 1.2 mm Land Grid Array (LGA) 48-pin package