We offer multilayer inductors with inductance from 0.15nH to 330mH, and self-resonant frequencies from 1MHz to 20GHz.An integrated multilayer-type inductor structure is formed by layering ceramic materials and a coil conductor. This enables a smaller size and lower cost compared to wire wound types.While the Q factor is lower than that of the wire wound structure, the multilayer structure provides good overall balance between the L value deviation, rated current, size, price, and other characteristics, enabling use in a wide range of applications.The multilayer structure is suitable for various applications such as RF circuit matching, choke, and resonance for mobile communication equipment.
Examples of our multilayer inductor product ranges
TE Connectivity’s 3671 Series SMD High Frequency Chip Inductors have a ceramic material construction that extends the effective frequency range to 10 GHz, and are available in four compact sizes. Operating Temperature Range: -55°C to +125°C. Applications include mobile phones, WLAN, and high speed communication devices.The Pulse BSCH Series is a type of ceramic chip inductor produced using multilayer technology. The series provides excellent Q factor and SRF characteristics and is suitable for high frequency applications. Its small size of 1005/1608 is suitable for small portable devices, and it supports operating frequencies up to 6GHz with nominal inductance values from 1.0nH to 470nH.Applications include RF resonance and impedance matching circuits, RF and wireless communication Information technology equipment, computers, telecommunications, radar detectors, automotive electronics, mobile phones, pagers, PDAs, keyless remote systems, and L-C filter configurations.TDK’s MLG Series of multilayer SMT inductors for high frequency applications feature an advanced monolithic structure; this is formed using a multilayering and sintering process with ceramic and conductive materials for high frequency. The products contain no lead and also support lead-free soldering.The inductors are used for high-frequency applications including mobile phones, high frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB and tuners.Show More
