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SM-K26-XCL2GC

Plug-In Module, XCK26-SFVC784-2LV-C, Kria SOM Carrier Card

AMD XILINX SM-K26-XCL2GC
AMD XILINX SM-K26-XCL2GC
AMD XILINX SM-K26-XCL2GC
AMD XILINX SM-K26-XCL2GC
AMD XILINX SM-K26-XCL2GC
AMD XILINX SM-K26-XCL2GC
AMD XILINX SM-K26-XCL2GC
AMD XILINX SM-K26-XCL2GC
AMD XILINX SM-K26-XCL2GC
AMD XILINX SM-K26-XCL2GC
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Manufacturer Part No:
SM-K26-XCL2GC
Order Code:
3763930
Technical Datasheet:
SM-K26-XCL2GC   Datasheet
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Product Information

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:
Xilinx

:
ARM

:
Cortex-A53

:
XCK26-SFVC784-2LV-C

:
Zynq UltraScale+ MPSoC

:
Kria SOM Carrier Card

:
Kria K26 System-on-Module XCK26-SFVC784-2LV-C

:
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Technical Documents (1)

CAD Downloads

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Terms and Conditions

CAD Models - Notice
CAD Models and drawings are provided to you on a revocable limited licence for your internal use only but remain the property of the manufacturer who retain all intellectual property rights and ownership. They are provided to assist you in decision making and as design guide but are not guaranteed to be error free, accurate or up to date and is not intended to be taken as advice.
Use of these CAD models and other options provided are downloaded and used entirely at your own risk and by continuing you confirm acceptance of the above.

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Product Overview

Xilinx® Kria™ K26 system-on-module (SOM) is a compact embedded platform that integrates a custom-built Zynq® UltraScale+™ MPSoC that runs optimally (and exclusively) on the K26 SOM with DDR memory, nonvolatile storage devices, a security module, and an aluminium thermal heat spreader. The SOM is designed to be plugged into a carrier card with solution-specific peripherals. Key target applications include smart city, machine vision, industrial robotics, and AI/ML computing. It offer random sampling, which can readily analyse high-bandwidth applications that involve repetitive signals or clock-related streams.
  • Zynq UltraScale+ MPSoC (XCK26 in commercial (C) grade
  • 4GB 64-bit wide DDR4 memory
  • Integrated non-volatile memory devices 512Mb QSPI, 16GB eMMC, 64Kb EEPROM
  • TPM2.0 security module
  • Two 240-pin connectors with access to user-configurable I/O
  • Integrated and flexible power design
  • Compact mechanical size with integrated thermal heat spreader
  • Enabled encryption
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