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60-5-10
Desoldering Braid, Soder-Wick®, No-Clean, Static Dissipative Bobbin, 0.15" x 10 ft
- Manufacturer:
- CHEMTRONICS CHEMTRONICS
- Manufacturer Part No:
- 60-5-10
- Order Code:
- 860712
- Technical Datasheet:
- 60-5-10 Datasheet
Alternatives for 60-5-10
Product Information
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- Oxygen Free Copper
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- 3.68mm
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- 3.048m
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Technical Docs (2)
Product Overview
The 60-5-10 is a Soder-Wick® No Clean Desoldering Braid designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. The Soder-Wick® No Clean SD safely removes solder in all applications requiring type ROL0 flux. BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. The Soder-Wick® No Clean safely removes solder from micro circuits, surface mount device pads, ball grid array pads, lugs and posts.
- Brown label on SD bobbin
- Minimizes the risk of damage associated with static electricity
- Patented non-corrosive, halide-free and organic no-clean flux
- Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
- Requires little or no post solder cleaning
- No corrosive residues
- Minimal risk of heat and static component damage
- Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for surface insulation resistance
- Packaged in ESD-safe static dissipative bobbins
Applications
Maintenance & Repair
No Longer Manufactured
Php902.50
Pricing is unavailable. Please contact customer services.
- Price for:
- Each
Multiple: 1 Minimum: 1
| Quantity | Price | Your Price |
|---|---|---|
| 1+ | Php902.50 | |
| 10+ | Php897.90 | |
| 20+ | Php893.30 | |
| 50+ | Php863.00 | |
Pricing is unavailable. Please contact customer services.
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