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BERGQUIST BOND PLY TBP 850

Thermal Insulator, Bond-Ply 100 .008", 12" x 12" Sheet, 0.8 W/m.K, 6 kV, 0.203 mm

BERGQUIST BOND PLY TBP 850
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Manufacturer:
BERGQUIST BERGQUIST
Manufacturer Part No:
BOND PLY TBP 850
Order Code:
1893438
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Technical Datasheet:
BOND PLY TBP 850   Datasheet
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Product Information

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0.8W/m.K

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6kV

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0.203mm

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Technical Documents (2)

Product Overview

The BP100-0.008-00-1212 is a 0.008-inch Thermal Insulator used in bond-ply products requires the use of dual liners to protect the surfaces from contaminants. Bergquist recommends a 6-month shelf life at a maximum continuous storage temperature of 35°C or 3-month shelf life at a maximum continuous storage temperature of 45°C, for maintenance of controlled adhesion to the liner. The shelf life of the bond-ply material, without consideration of liner adhesion (which is often not critical for manual assembly processing), is recommended at 12 months from date of manufacture at a maximum continuous storage temperature of 60°C. It is suitable for mount heat sink onto BGA graphic processor or drives processor and mounts heat spreader onto power converter PCB or onto motor control PCB applications.
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Applications

Thermal Management

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